| intCertNum |
2595 |
| strVendorName |
Chunghwa Telecom Co., Ltd. |
| strURL |
http://www.cht.com.tw |
| strAddress1 |
No.99, Dianyan Road |
| strAddress2 |
Yang-Mei |
| strAddress3 |
|
| strCity |
Taoyuan |
| strStateProv |
Taiwan |
| strPostalCode |
326 |
| strCountry |
326 |
| strContact |
Yeou-Fuh Kuan |
| strEmail |
kufo@cht.com.tw |
| strPhone |
+886-3-424-4333 |
| strFax |
+886-3-424-4129 |
| strContact2 |
Char-Shin Miou |
| strEmail2 |
mcs@cht.com.tw |
| strFax2 |
+886-3-424-4129 |
| strPhone2 |
+886 3 424 4381 |
| intCertNum |
2595 |
| strModuleName |
HiCOS PKI Native Smart Card Cryptographic Module |
| strPartNumber |
Hardware Version: RS45C;
Firmware Versions: HardMask: 2.2 and SoftMask: 1.2 |
| memModuleNotes |
No assurance of the minimum strength of generated keys |
| str140Version |
140-2 |
| _sp_ |
Security Policy [pdf][html][txt] |
| _cert_ |
Certificate [pdf] |
| strPURL |
|
| strModuleType |
Hardware |
| strValidationDate |
03/29/2016 |
| intOverallLevel |
2 |
| memIndividualLevelNotes |
-Cryptographic Module Ports and Interfaces: Level 3;-Roles, Services, and Authentication: Level 3;-Physical Security: Level 3;-EMI/EMC: Level 3;-Design Assurance: Level 3;-Operational Environment: N/A |
| strFIPSAlgorithms |
CVL (Cert. #614);
DRBG (Cert. #927);
ECDSA (Cert. #731);
RSA (Cert. #1846);
SHS (Cert. #2953);
Triple-DES (Cert. #1999) |
| strOtherAlgorithms |
NDRNG;
RSA (key wrapping;
key establishment methodology provides 112 bits of encryption strength);
Triple-DES (Certs. #1999, key wrapping;
key establishment methodology provides 112 bits of encryption strength) |
| strConfiguration |
Single Chip |
| memModuleDescription |
The HiCOS PKI native smart card module is a single chip implementation of a cryptographic module. The HiCOS PKI native smart card module is mounted in an ID-1 class smart card body that adheres to ISO/IEC specifications for Integrated Circuit Chip (ICC) based identification cards. The module consists of the chip (ICC), the contact faceplate, and the electronic connectors between the chip and contact pad, all contained within an epoxy substrate. |
| intModuleCount |
1 |
| memAdditionalNotes |
|
| strFirstValidtionDate |
03/29/16 00:00:00 |
| strLabName |
CGI |
| strValidationYear |
2016 |